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E07-400T10S SoC 贴片型无线模块
E07-400T10S ee 410-450MHz patch wireless module ye looi në MSP430FR2433 ku CC1101 ye looi në Texas Instruments (TI) në United States, ye kɔc kony bïk
Detalji proizvoda
| Parameters ye kɔrɔ | Description |
Kommentar |
| Reference distance |
1.5km |
A cɛ̈ɛ̈r ye cɛ̈ɛ̈r ye cɛ̈ɛ̈r ye cɛ̈ɛ̈r ye cɛ̈ɛ̈r ye cɛ̈ɛ̈r ye cɛ̈ɛ̈r ye cɛ̈ɛ̈r |
| FIFO |
64Byte |
Maximum length of sending one time (Dɔŋ ye dɔŋ ye dɔŋ ye dɔŋ ye dɔŋ ye dɔŋ ye dɔŋ ye dɔŋ ye dɔŋ) |
| Frequency Crystal Vibration |
26MHz |
Vibration raan |
| Modɛl |
GFSK ((ye raan) |
A kony OOK, ASK, GFSK, 2-FSK, 4-FSK ku MSK |
| Paket diwal |
Patch stamp hole |
Half hole, gap hole 1.27mm |
| MCU |
MSP430FR2433 |
Texas Instruments |
| Interface ë komunikasyon |
UART、SPI、ADC、GPIO |
Users themselves need to develop settings |
| Dimensions |
14*26mm |
- |
| Antenna Interface |
IPEX/Stamp Hole |
Impedance ye 50 ohm |
| Parameters elektrik | Minimum | Luɔi tipikal | Maksimum | Unit | Kondition |
| Voltage ye luui |
2.5 | 5.0 | 5.5 |
V | ≥5.0V lëu bɛ̈n ya gam Module ye tɔ̈ɔ̈u ye tɔ̈ɔ̈u ye tɔ̈ɔ̈u ye tɔ̈ɔ̈u ye 5.5V |
| Band de luɔi |
410 |
433 |
450 |
MHz |
Luɔi ISM band |
| Level of Communication (Level of Communication) | - | 3.3 | - | V |
Luɔi5V TTLA riske burning |
| Run Current | - |
35 | - | mA | Power consumption ye tɛmɛ |
| Receive Current (Wɛɛr) | - | 18 | - |
mA |
- |
| Sleep Current | - | 0.6 | - | uA | Software dɔ̈ɔ̈r |
|
Temperature de luɔi |
-40 | - |
+85 | ℃ |
Industri |
| Maximum Power ye looi |
9.5 | 10 | 11 | dBm |
- |
| Sensitivity ye yök |
-107 |
-106 dBm |
-109 |
dBm |
A tɛmɛ 1.2kbps |
| Air Speed |
0.6k | - | 500k | bps |
Programming Control ye raan luɔi |
| Serial No |
Pin | Pin direction |
Kommentar |
| 1 | SWDIO | Input |
Download/debug port, tïŋ chip manual (MSP430FR2433) |
| 2, 11, 13 ~17, 26 |
GND |
（-） |
Wire, Connect to Power Reference |
| 3 | SWCLK | Input |
Download/debug port, tïŋ chip manual (MSP430FR2433) |
| 4 | 3.3V | Input |
Download program ye 3.3V |
| 5 | P2.0/XOUT | Lɔ/Lɔ |
Ba wël kɔ̈k yök, tïŋ Chip Manual (MSP430FR2433) |
| 6 | P2.1/XIN | Lɔ/Lɔ |
Ba wël kɔ̈k yök, tïŋ Chip Manual (MSP430FR2433) |
| 7 | P1.4/UCA0TXD |
Lɔ/Lɔ |
Ba wël kɔ̈k yök, tïŋ Chip Manual (MSP430FR2433) |
| 8 | P1.5/UCA0RXD |
Lɔ/Lɔ |
Ba wël kɔ̈k yök, tïŋ Chip Manual (MSP430FR2433) |
| 9 | P1.6/UCA0CLK |
Lɔ/Lɔ |
Ba wël kɔ̈k yök, tïŋ Chip Manual (MSP430FR2433) |
| 10 | P1.7/UCA0STE | Lɔ/Lɔ |
Ba wël kɔ̈k yök, tïŋ Chip Manual (MSP430FR2433) |
| 18 | P2.3 | Lɔ/Lɔ |
Ba wël kɔ̈k yök, tïŋ Chip Manual (MSP430FR2433) |
| 19 | P3.1/UCA1STE | Lɔ/Lɔ | Ba wël kɔ̈k yök, tïŋ Chip Manual (MSP430FR2433) |
| 20 | P2.4/UCA1CLK | Lɔ/Lɔ |
Ba wël kɔ̈k yök, tïŋ Chip Manual (MSP430FR2433) |
| 21 | P2.7 | Lɔ/Lɔ |
Ba wël kɔ̈k yök, tïŋ Chip Manual (MSP430FR2433) |
| 22 |
P2.5/UCA0RXD |
Lɔ/Lɔ |
Ba wël kɔ̈k yök, tïŋ Chip Manual (MSP430FR2433) |
| 23 | P2.6/UCA0TXD |
Lɔ/Lɔ |
Ba wël kɔ̈k yök, tïŋ Chip Manual (MSP430FR2433) |
| 24 | P3.2 |
Lɔ/Lɔ |
Ba wël kɔ̈k yök, tïŋ Chip Manual (MSP430FR2433) |
|
25 |
+5V |
Input |
Module power input, a lëu bï ya (2.5V-5.5V) |
| Note 1: Ha nder module, GDO0, GDO2 CC1101 RF chip ye kek mat keke P3.0, P2.2 MCU chip MSP430FR2433. Lɔ̈k ba wël kɔ̈k yök, tïŋ yɔɔ̈ɔ̈r 5. | |||
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| Produk Model |
Interface jili | Chip Scheme | Frequency ye kɔl Hz | Puwol dBm | Test distance km | Air Speed bps |
Formu Paket | Dimension produk mm | Karakteristika Produk | Teknoloji Buku |
Sample Buy |
|---|---|---|---|---|---|---|---|---|---|---|---|
| SPI | CC1101 | 868M | 10 | 1.5 | 0.6k~500k | Patch | 14*26m | Small size, low power development | |||
| SPI | CC1101 | 433M | 10 | 1.5 | 0.6k~500k | Patch | 14*26m | Small size, low power development | |||
| USB | - | - | - | - | - | - | 53*27mm | E07-900M10S Development Assessment Kit | |||
| USB | - | - | - | - | - | - | 53*27mm | E07-400M10S Development Assessment Kit | |||
| SPI | CC1101 | 868M | 10 | 1.5 | 0.6k~500k | Patch | 14*20m | Small size, low power development | |||
| SPI | CC1101 | 433M | 20 | 2 | 0.6k~500k | Patch | 18 * 32 | Small size, low power development | |||
| SPI | CC1101 | 433M | 10 | 1.5 | 0.6k~500k | Patch | 14*20m | Small size, low power development | |||
| SPI | CC1101 | 915M | 10 | 1.2 | 0.6k~500k | Patch | 13 * 19 | Small volume, can develop low power consumption | |||
| SPI | CC1101 | 868M | 10 | 1.0 | 0.6k～500k | Patch | 13 * 19 | Small volume, can develop low power consumption | |||
| SPI | CC1101 | 433M | 10 | 0.5 | 0.6k~500k | Insert | 15 * 30 | High performance, low power consumption | |||
| SPI | CC1101 | 433M | 10 | 0.6 | 0.6k~500k | Insert | 15 * 30 | High performance, low power consumption | |||
| SPI | CC1101 | 433M | 10 | 0.4 | 0.6k~500k | Patch | 13 * 19 | Small volume, can develop low power consumption |
-
E07-900T10S
Model: E07-900T10S
Interface jili
:SPI
Chip Scheme
:CC1101
Frequency of carrier Hz (Frequency of carrier Hz) (Frequency of carrier Hz) (Frequency of carrier Hz) (Frequency of carrier Hz) (Frequency of carrier Hz) (Frequency of carrier Hz) (Frequency of carrier Hz)
:868M
Puwol dBm
:10
Test distance km
:1.5
Lɛɛr ye cɔl bps
-
:0.6k~500k
Formu Paket
: Patch
Dimension produk mm
:14*26m
Features: Small size, can develop low power consumption
PDF ：
Yïn ɣaac:
E07-400T10S
Model: E07-400T10S
Interface jili
:SPI
Chip Scheme
-
:CC1101
Frequency of carrier Hz (Frequency of carrier Hz) (Frequency of carrier Hz) (Frequency of carrier Hz) (Frequency of carrier Hz) (Frequency of carrier Hz) (Frequency of carrier Hz) (Frequency of carrier Hz)
:433M
Puwol dBm
:10
Test distance km
:1.5
Lɛɛr ye cɔl bps
:0.6k~500k
Formu Paket
: Patch
Dimension produk mm
:14*26m
-
Features: Small size, can develop low power consumption
PDF ：
Yïn ɣaac:
E07-900MBL-01
Model: E07-900MBL-01
Interface jili
:USB
Chip Scheme
:-
Frequency of carrier Hz (Frequency of carrier Hz) (Frequency of carrier Hz) (Frequency of carrier Hz) (Frequency of carrier Hz) (Frequency of carrier Hz) (Frequency of carrier Hz) (Frequency of carrier Hz) (Frequency of carrier Hz) (Frequency of carrier Hz) (Frequency of carrier Hz)
:-
Puwol dBm
:-
-
Test distance km
:-
Lɛɛr ye cɔl bps
:-
Formu Paket
:-
Dimension produk mm
:53*27mm
Kä ye kek looi: E07-900M10S Development Assessment Kit
PDF ：
Yïn ɣaac:
E07-400MBL-01
Model: E07-400MBL-01
-
Interface jili
:USB
Chip Scheme
:-
Frequency ye kɔl Hz
:-
Puwol dBm
:-
Test distance km
:-
Lɛɛr ye cɔl bps
:-
Formu Paket
-
:-
Dimension produk mm
:53*27mm
Kä ye kek looi: E07-400M10S Development Assessment Kit
PDF ：
Yïn ɣaac:
E07-900M10S
Model: E07-900M10S
Interface jili
:SPI
Chip Scheme
:CC1101
Frequency ye kɔl Hz
-
:868M
Puwol dBm
:10
Test distance km
:1.5
Lɛɛr ye cɔl bps
:0.6k~500k
Formu Paket
: Patch
Dimension produk mm
:14*20m
Features: Small size, can develop low power consumption
PDF ：
-
Yïn ɣaac:
E07-433M20S
Model: E07-433M20S
Interface jili
:SPI
Chip Scheme
:CC1101
Frequency of carrier Hz (Frequency of carrier Hz) (Frequency of carrier Hz) (Frequency of carrier Hz) (Frequency of carrier Hz) (Frequency of carrier Hz) (Frequency of carrier Hz) (Frequency of carrier Hz) (Frequency of carrier Hz)
:433M
Puwol dBm
:20
Test distance km
:2
-
Lɛɛr ye cɔl bps
:0.6k~500k
Formu Paket
: Patch
Dimension produk mm
:18 * 32
Features: Small size, can develop low power consumption
PDF ：
Yïn ɣaac:
E07-400M10S
Model: E07-400M10S
Interface jili
:SPI
-
Chip Scheme
:CC1101
Frequency of carrier Hz (Frequency of carrier Hz) (Frequency of carrier Hz) (Frequency of carrier Hz) (Frequency of carrier Hz) (Frequency of carrier Hz) (Frequency of carrier Hz) (Frequency of carrier Hz)
:433M
Puwol dBm
:10
Test distance km
:1.5
Lɛɛr ye cɔl bps
:0.6k~500k
Formu Paket
: Patch
Dimension produk mm
-
:14*20m
Features: Small size, can develop low power consumption
PDF ：
Yïn ɣaac:
E07-915MS10
Model: E07-915MS10
Interface jili
:SPI
Chip Scheme
:CC1101
Frequency ye kɔl Hz
:915M
Puwol dBm
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