FPC Cover Film Laser Cutting Machine

Kä ye kek looi në FPC, PCB, ceramic, ku jɔl ya kä ye kek looi, ye kek looi në laser ultraviolet ye kek looi në laser ye kek looi në laser ye kek looi në laser ye kek looi në laser ye kek looi në laser ye kek looi në laser ye kek looi në laser ye kek looi
Pan.Application areas: FPC, PCB, soft hard bonding board cutting, fingerprint chip module cutting, soft ceramic cutting, covering film opening windows.

FPC Cover Film Laser Cutting Machine Application Industry
Fingerprint recognition chip cutting; ye kɔc ye kɔc ye kɔc ye kɔc ye kɔc ye kɔc ye kɔc ye kɔc ye kɔc ye kɔc ye kɔc ye kɔc ye kɔc FPC ye kɛ̈ɛ̈r ye kɛ̈ɛ̈r ye kɛ̈ɛ̈r ye kɛ̈ɛ̈r ye kɛ̈ɛ̈r PCB Circuit Board Distribution Cutting.

FPC Cover Film Laser Cutting Machine Features
Laser ye kɛ̈ɛ̈r ye kɛ̈ɛ̈r ye kɛ̈ɛ̈r ye kɛ̈ɛ̈r ye kɛ̈ɛ̈r ye kɛ̈ɛ̈r ye kɛ̈ɛ̈r ye k
Saan juëc looi, luɔɔi de luɔɔi de luɔɔi de luɔɔi de luɔɔi de luɔɔi de luɔɔi de luɔɔi de luɔɔi de luɔɔi de luɔɔi de luɔɔi de luɔɔi de luɔɔi
Equipment with optical marble platform, high speed high precision linear motor and negative pressure adsorption system, positioning accuracy, processing stability high. Equipment with optical marble platform, high speed high precision linear motor and negative pressure adsorption system, positioning accuracy, processing stability high. Equipment with optical marble platform, high speed high precision linear motor and negative pressure adsorption system
Lɔ̈ɔ̈m ë man ku lɔ̈ɔ̈m ë man ku lɔ̈ɔ̈m ë man ku lɔ̈ɔ̈m ë man ku lɔ̈ɔ̈m ë man ku lɔ̈ɔ̈m ë man ku lɔ̈ɔ̈m ë man

FPC Cover Film Laser Cutting Machine
Laser ultraviolet nanosecond ye luɔ̈ɔ̈i, ye kɛnɛya ye kɛnɛya ye kɛnɛya ye kɛnɛya ye kɛnɛya ye kɛnɛya ye kɛnɛya ye kɛnɛya ye kɛnɛya ye kɛnɛya
Focus spots can be as small as 10μm, suitable for all organic & inorganic materials fine cutting holes. Focus spots can be as small as 10μm, suitable for all organic & inorganic materials fine cutting holes.
CCD Vision Pre-Scanning & Automatic Grab Target Positioning, Maximum Processing Range 500mm × 350mm, XY Platform Splicing Precision ≤ ± 5μm;
A kony kä juëc ye kek tïŋ, cït mɛn cross, solid circle, hollow circle, L type straight angle edge, image characteristic point, etc.;
Robot ye rot looi, ye rot looi, ye rot looi, ye rot looi, ye rot looi, ye rot looi, ye rot looi, ye rot looi, ye rot looi, ye rot looi, ye rot looi, ye rot looi, ye rot looi
8 years laser microprocessing system R&D design technology accumulation, performance stable, no consumables; 8 years laser microprocessing system R&D design technology accumulation, performance stable, no consumables; 8 years laser microprocessing system R&D design technology accumulation, performance stable, no consumables

FPC FilmLaser Cutting Machine Training & After Sale