Cisco Optoelectric Technology (Shanghai) Co., Ltd.
Kuæa>Proizvodi>Micro-processing surface roughness measurement (Kɔɔr kä ye kek looi)
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Micro-processing surface roughness measurement (Kɔɔr kä ye kek looi)
Ink thickness 3D shape and measurement measurement requirements Scanning measurement sprayed ink 3D shape
Detalji proizvoda
  • Ink thickness 3D shape and measurement

    Measurement requirements
    Scan and measure the sprayed ink 3D shape, extract profile and measure the ink thickness. Scan and measure the sprayed ink 3D shape, extract profile and measure the ink thickness. Scan and measure the sprayed ink 3D shape, extract profile and measure the ink thickness.

    Key Features Overview
    1.Non-contact measurement, integrated design

    2. 3D morphology scanning, multi-function data processing
    3. A lëu bï ya tɛmɛ në kä juëc yiic

    4.Easy luɔ̈ɔ̈i, looi looi looi looi looi looi looi looi looi looi looi looi looi looi looi looi looi looi looi looi looi looi looi looi looi

    5. Scanning speed, tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ

    6. ±0.5 to ±1μm repeat precision guarantee

    7.Stability, anti-interference capability

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    Results measurement
    Ink thickness ye 10 μm

    Lɔ̈k kä ye kek yök në tɛ̈n yenë tɛ̈n yenë tɛ̈n yenë tɛ̈n yenë tɛ̈n yenë tɛ̈n yenë

    1. A wɛ̈t ye kɔɔr në kä ye kek them
    2.Contact measurement, ye kë ye kek tɛ̈n ye kek tɛ̈n ye kek tɛ̈n ye kek tɛ̈n ye kek tɛ̈n ye kek tɛ̈n ye
    3. ye tɛ̈n tɔ̈u, tɛ̈n tɔ̈u, tɛ̈n tɔ̈u, tɛ̈n tɔ̈u
    4.Measuring speed slow, precision low, measurement error large

    5. Structure complex, wëu juëc

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