Produk Profile
Pikosecond Laser Micro Processing System:
Laser Pikosecond Laser Micro Processing System ye luui në 140W ye Germany High power infrared and green light dual-band output picosecond solid laser, fully realize high precision and high efficiency, high hardness fragile materials microprocessing, can be suitable for any heat sensitive and high hardness fragile materials of drilling, cutting, engraving processing, picosecond laser processing when because pulse width is particularly narrow, laser frequency is particularly high, ultra high peak power, almost no heat conduction produced, so processing for heat sensitive materials when no heat impact and stress produced, picosecond laser processing belongs to the current laser industry's most promising third generation precision cold processing method, is the future trend of laser industry can be applied to reinforced glass, ultra thin metal sheets, ceramic substrates, sapphire substrates and other all materials of micropore drilling and fine cutting processing, current mainstream applications have mobile glass cover cutting, Kɔl ye kɔl ye kɔl ye kɔl ye kɔl ye kɔl ye kɔl ye kɔl ye kɔl ye kɔl ye kɔl ye kɔl ye kɔl ye kɔl ye kɔl ye kɔl ye kɔl ye kɔl ye kɔl ye kɔl ye kɔl ye kɔl

Karakteristika:
1.HL-650 ultra-fast picosecond laser microprocessing system ye luui në software de laser de laser de laser de laser de laser de laser de laser de laser de laser de laser de laser de laser de laser de laser de laser de laser de laser de laser de laser de laser de laser de laser de laser de laser de laser de laser de laser de laser de laser de laser de laser de laser de laser de laser de laser de laser de laser de laser de laser XY platform precision motion large size single seamless splicing Laser Laser and scanning oscilloscope precision machining synchronized performed, single-time machining 650mm * 650mm range, ten years software technology accumulation, mature and stable software technology, editing function strong, can achieve large graphics automatic cutting or manual cutting selection, splicing accuracy up to ≤3um.
2.Powerful software function supports various visual positioning features: such as cross, solid circle, hollow circle, cross plus hollow circle, L-type straight angle edge, image feature point positioning vision, very convenient when processing without fittings case positioning. 2.Powerful software function supports various visual positioning features: such as cross, solid circle, hollow circle, cross plus hollow circle, L-type straight angle edge, image feature point positioning vision, very convenient when processing without fittings case positioning!
3. HL-650 picosecond laser microprocessing system uses German 355nm.532nm..1064nm three-band adjustable picosecond laser, maximum laser power 50w pulse width only 10ps, ultra short pulse width makes laser processing without heat transmission, so when processing heat impact more sensitive materials without any heat impact and stress generation, picosecond laser processing belongs to the precision cold processing method, can be applied to paper, glass, metal, ceramic, sapphire and other materials all processing, even when processing on explosives and other materials will not occur explosion.

Industri ye luɔɔi:
Telephone cover, optical glass, sapphire substrate, ultra thin metal sheet material, ceramic substrate and other materials micropore drilling and fine cutting. Kä ye kek tɔ̈ɔ̈u në luɔɔi ye kek tɔ̈ɔ̈u në luɔɔi ye kek tɔ̈ɔ̈u në luɔɔi ye kek tɔ̈ɔ̈u në luɔɔi ye kek tɔ̈ɔ̈u në luɔɔi ye kek tɔ̈ɔ̈u në luɔɔi ye kek tɔ̈ɔ̈u në luɔɔi ye kek tɔ̈ɔ̈u në luɔɔi ye kek tɔ̈

Parameters Technical:

Parameter Model	HL-650
Laser jili	355nm 523nm 1064nm 3band Rapid50W 10ps Laser
Laser Power	50W
Laser ye dɔŋ ye dɔŋ ye dɔŋ ye dɔŋ ye dɔŋ ye dɔŋ ye dɔŋ ye dɔŋ ye dɔŋ ye dɔŋ ye dɔŋ	15um (355nm ye dɛ̈t ye dɛ̈t ye dɛ̈t ye dɛ̈t ye dɛ̈t ye dɛ̈t ye dɛ̈t ye dɛ̈t ye dɛ̈t 25um 1064um Laser ye rot looi
Laser ye luui në kaam tök	67 × 67mm 15um Width 170 × 170mm 40um Width
Laser processing line splicing precision	≤±3um
Laser processing speed	100-3000mm/s lëu bï ya waar
XY Platform's Maximum Movement Speed	800mm/s 1G Acceleration
XY platform repeat precision	≤±1um
XY platform tɛmɛ	≤±3um
CCD tɛmɛ	≤±3um
Power supply	5kw/Ac220V/50Hz
Cooling Method	Pii koor
Dimension dɔ	2300mm×2000mm×1950mm

Sample of cutting hole: